Wafer Edge Grinders

Overview

The wafer edge grinders are designed to grind edge and circumference of a wide variety of wafers including silicon, compound semiconductors, such as, SiC, GaN, GaAs, and InP, oxide wafers, such as sapphire, quartz, LT, and LN, and glass, at high precision through numerical control.
Our edge grinders are attracting attention as requirements become more stringent for precision and processing quality of wafer edge and circumference. They are also attracting attention as the measures for knife edge to improve the yield in the device process.
We provide solutions for various requirements from customers and challenges with our edge grinders.

1.WBM-2000A Series

●Applicable to a wide range of wafer sizes from 2-inch to 8-inch and materials
●1 or 2 grinding stage(s)
●4 cassettes as standard (Options available)
●High precision beveling with forming grinding wheels inheriting the　conventional numerically controlled grinding
●Compact design
●Capable of connecting to network

1.CVP-2000 Series

●High precision and high performance beveling with vertical grinding wheels
●Applicable to Si wafers and hard materials, such as SiC and GaN wafers
●Applicable to a wide range of wafer sizes from 2-inch to 8-inch and materials
(Options available)
●1 or 2 grinding stage (s)
●4 cassettes as standard (Options available)
●Compact design
●Capable of connecting to network

2.CVP-3000 Series

●High precision and high performance beveling with vertical grinding wheels
●Applicable to 12-inch wafers
●1 or 2 grinding stage (s)
●4 cassettes as standard (Options available)
●Additional measurement function available
●Capable of connecting to network for factory automation