The scribe machines automatically perform parallel alignment and positioning and scribe silicon substrates and compound semiconductor substrates, such as GaAs, InP, and GaN.
It is capable for processing maximum of 4-inch wafers and wafer-to-bar scribing, bar-to-chip scribing, and full scribing are available. Unlike dicing machines, the scribing is dry-processing, not using water.
The device pattern registered for each recipe is recognized in image processing and used for the parallel alignment.
●Simple control screen and touch panel operation
●Applicable to backside patterned wafers as an option
●Unique boat-shapes scribing, providing sharp scribed shapes
●Compact and space-saving