Wafer Edge Grinders

Wafer Edge Grinders

Since introducing the world’s first Numeric Controlled Edge Grinder over 30 years ago,
Daitron has continued to make improvements in quality and yield to the processing of Silicon and other semi-conductive materials.  

The latest V-Twin contouring technology utilizes the 2 axis vertical grinding process.  This system assures the best results in terms of dimensional accuracy and precision.  The edge profile also has an improved finish which helps to reduce residual stress in the wafer edge area.  

The throughput has increased 140% that of conventional systems while at the same time decreasing machine footprint area by 50%.

For more information, please visit our product web site for wafer edge grinders at    www.waferedgegrinder.com or Contact our local sales office near you today.