Join us at ICSCRM 2025

Daitron will be exhibiting at ICSCRM 2025.
We look forward to welcoming you to our booth.

[Expo Date] SEP 14-19, 2025
[Location] Exhibition Center 1 Hall #1 l BEXCO, BUSAN, KOREA
[booth No] 010
[Official Site] https://icscrm2025.org/
[Exhibitor] Daitron Co., Ltd.

Product Highlights

	Laser Annealing / YIELDSCAN🄬ALA│JSW Aktina System Co., Ltd. Extremely High Productivity by Excimer Laser System Damage-Free Laser Process &Transfer for Si / SiC Wafer Easy Maint. / Less Down-time by Clean Airflow Mechanism
	Integrated Optical Inspection System│SEIWA OPTICAL CO.,LTD. DIC, Photoluminescence, and Raman Spectroscopy -Three Methods in One System. Non-Destructive Detection of Defects from the Surface to Deep Regions Direct Connection Between Defect Origin Analysis and Process Optimization
	Wafer Edge Grinder / CVP-2200/3000│Daitron Co., Ltd. 6” to 230 mm wafer compatible. Up to 330 mm (under development) Supports FOUP, FOSB, and a wide range of specifications. Enhanced beveling precision with optional add-on measurement function. Extended grinding wheel life with contouring process. > read more