Scribing machine automatically performs parallel alignment and positioning of compound semiconductor substrates such as GaAs and InP, and carries out primary and secondary scribing as well as full scribing for chip preparation. Then Cleaving machine cleaves and divides them starting from scribe marks.
Mounting & Demounting Machines│DaitronCo., Ltd.
The Mounter is equipment designed to mount wafers onto carrier substrates in wafer thinning processes using adhesives such as WAX. The Demounter is equipment designed to separate wafers used in wafer thinning processes from their carrier substrates.
Solid-Source ECR Plasma Deposition System |JSW AFTY
The Standard Deposition System for Optical Communications and Blue LD Applications, with a proven track record of over 200 units delivered. High-density, electrodeless plasma is generated through electron resonance using a magnetic field and microwaves. AR & HR Coating Film Thickness Distribution: ±5% or less (Achieved: ±2% or less) High-quality deposition helps reduce COD and extend device lifetime.
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