model		WBM-2100	WBM-2200
GD unit	qty of grind axis	1	2
wafer size	2" ～ 6"	selectable
	3" ～ 8"	selectable
wafer type	OF	OK
	notch	option
material	silicon	OK
	compound wafer	option
	single element wafer	option
	SOI	option
	others	option
load / unload	cassettes*	4 to 8
	non-cassette	option
spindle	for 200mm wheel	std.
	for 100mm wheel	option
	for notch wheel	option
thickness gauge	contact 1 pt.	option
	contact multi pts.	option
	non-contact multi. pts.	option
alignment unit	edge non-contact	selectable
	edge grip	selectable
cleaner unit	spin cleaner	std.
diameter meas.	pre-grind	option
	post grind	option
bevel shape	R type	std.
	T type	std.
	Flat type	std.
	non symetric*	std.
	step or terrace type*	option

cassettes* : cassettes number is dictated by wafer size

non symetric* : grinding wheel shape will reflect the bevel shape.

step or terrace type* : grinding wheel shape will reflect the bevel shape.

note : specification mentioned above may change without any consultation.